Boot partitions in memory devices and systems

ABSTRACT

The present disclosure includes boot partitions in memory devices and systems, and methods associated therewith. One or more embodiments include an array of memory cells, wherein the array includes a boot partition and a number of additional partitions. Sequential logical unit identifiers are associated with the additional partitions, and a logical unit identifier that is not in sequence with the sequential logical unit identifiers is associated with the boot partition.

TECHNICAL FIELD

The present disclosure relates generally to semiconductor memorydevices, methods, and systems, and more particularly, to boot partitionsin memory devices and systems

BACKGROUND

Memory devices are typically provided as internal, semiconductor,integrated circuits and/or external removable devices in computers andother electronic devices. There are many different types of memoryincluding random-access memory (RAM), read only memory (ROM), dynamicrandom access memory (DRAM), synchronous dynamic random access memory(SDRAM), phase change random access memory (PCRAM), and flash memory,among others.

Flash memory devices can be utilized as volatile and non-volatile memoryfor a wide range of electronic applications. Flash memory devicestypically use a one-transistor memory cell that allows for high memorydensities, high reliability, and low power consumption. Uses for flashmemory include memory for solid state drives (SSDs), personal computers,personal digital assistants (PDAs), digital cameras, cellulartelephones, portable music players, e.g., MP3 players, and movieplayers, among other electronic devices. Data, such as program code,user data, and/or system data, such as a basic input/output system(BIOS), are typically stored in flash memory devices.

Two common types of flash memory array architectures are the “NAND” and“NOR” architectures, so called for the logical form in which the basicmemory cell configuration of each is arranged. A NAND array architecturearranges its array of memory cells in a matrix such that the controlgates of each memory cell in a “row” of the array are coupled to (and insome cases form) an access line, which is commonly referred to in theart as a “word line”. However each memory cell is not directly coupledto a data line (which is commonly referred to as a digit line, e.g., abit line, in the art) by its drain. Instead, the memory cells of thearray are coupled together in series, source to drain, between a commonsource and a data line, where the memory cells commonly coupled to aparticular data line are referred to as a “column”.

Memory cells in a NAND array architecture can be programmed to a desiredstate. For example, electric charge can be placed on or removed from acharge storage node of a memory cell to put the cell into one of anumber of programmed states. For example, a single level cell (SLC) canrepresent two states, e.g., 1 or 0. Flash memory cells can also storemore than two states, e.g., 1111, 0111, 0011, 1011, 1001, 0001, 0101,1101, 1100, 0100, 0000, 1000, 1010, 0010, 0110, and 1110. Such cells canbe referred to as multilevel cells (MLCs). MLCs can allow themanufacture of higher density memories without increasing the number ofmemory cells since each cell can represent more than one digit, e.g.,more than one bit. For example, a cell capable of representing fourdigits can have sixteen programmed states.

A memory system can include a host, such as a computer, and varioustypes of memory used in various combinations to provide memory for thehost. For example, a memory system can include a host and an externalmemory device coupled to the host. The external memory device can be,for example, a flash memory device. Additionally, the external memorydevice can be a removable memory device coupled to the host through aninterface, such as a USB connection, for example.

The external memory device can include, e.g., store, system boot codeused to boot the memory system. For example, responsive to a bootingevent of the memory system, the boot code, e.g., data representing theboot code, can be loaded from the external memory device to the host,and the host can use the boot code to boot the memory system. However,the boot code stored in the memory device may be visible to a user ofthe host.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a diagram of a portion of a memory array having anumber of physical blocks in accordance with one or more embodiments ofthe present disclosure.

FIG. 2 illustrates a block diagram of a memory device in accordance withone or more embodiments of the present disclosure.

FIG. 3 illustrates a block diagram of a memory system in accordance withone or more embodiments of the present disclosure.

DETAILED DESCRIPTION

The present disclosure includes boot partitions in memory devices andsystems, and methods associated therewith. One or more embodimentsinclude an array of memory cells, wherein the array includes a bootpartition and a number of additional partitions. Sequential logical unitidentifiers are associated with the additional partitions, and a logicalunit identifier that is not in sequence with the sequential logical unitidentifiers is associated with the boot partition.

Embodiments of the present disclosure can prevent a user from viewing aboot partition, e.g., boot code, included, e.g., stored, in a memorydevice. For example, the boot partition in the memory device may not bevisible to a user of a host coupled to the memory device. That is, theboot partition may be hidden from the user.

In the following detailed description of the present disclosure,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration how a number of embodimentsof the disclosure may be practiced. These embodiments are described insufficient detail to enable those of ordinary skill in the art topractice the embodiments of this disclosure, and it is to be understoodthat other embodiments may be utilized and that process, electrical,and/or structural changes may be made without departing from the scopeof the present disclosure.

As used herein, “a number of” something can refer to one or more suchthings. For example, a number of memory devices can refer to one or morememory devices. Additionally, the designators “B”, “P”, “R”, and “S” asused herein, particularly with respect to reference numerals in thedrawings, indicates that a number of the particular feature sodesignated can be included with a number of embodiments of the presentdisclosure.

The figures herein follow a numbering convention in which the firstdigit or digits correspond to the drawing figure number and theremaining digits identify an element or component in the drawing.Similar elements or components between different figures may beidentified by the use of similar digits. For example, 232 may referenceelement “32” in FIG. 2, and a similar element may be referenced as 332in FIG. 3. As will be appreciated, elements shown in the variousembodiments herein can be added, exchanged, and/or eliminated so as toprovide a number of additional embodiments of the present disclosure. Inaddition, as will be appreciated, the proportion and the relative scaleof the elements provided in the figures are intended to illustrate theembodiments of the present disclosure, and should not be taken in alimiting sense.

FIG. 1 illustrates a diagram of a portion of a memory array 100 having anumber of physical blocks in accordance with one or more embodiments ofthe present disclosure. Memory array 100 can be, for example, a NAND orNOR flash non-volatile memory array. However, embodiments of the presentdisclosure are not limited to a particular type of memory array.Further, although not shown in FIG. 1, one of ordinary skill in the artwill appreciate that memory array 100 can be located on a particularsemiconductor die along with various peripheral circuitry associatedwith the operation thereof.

As shown in FIG. 1, memory array 100 has a number of physical blocks116-0 (BLOCK 0), 116-1 (BLOCK 1), . . . , 116-B (BLOCK B) of memorycells. The memory cells can be single level cells and/or multilevelcells. As an example, the number of physical blocks in memory array 100may be 128 blocks, 512 blocks, or 1,024 blocks, but embodiments are notlimited to a particular multiple of 128 or to any particular number ofphysical blocks in memory array 100.

In the example shown in FIG. 1, each physical block 116-0, 116-1, . . ., 116-B includes memory cells which can be erased together as a unit,e.g., the cells in each physical block can be erased in a substantiallysimultaneous manner. For instance, the memory cells in each physicalblock can be erased together in a single erase operation.

As shown in FIG. 1, each physical block 116-0, 116-1, . . . , 116-Bcontains a number of physical rows, e.g., 120-0, 120-1, . . . , 120-R,of memory cells coupled to access lines, e.g., a word lines. The numberof rows, e.g., word lines, in each physical block can be 32, butembodiments are not limited to a particular number of rows 120-0, 120-1,. . . , 120-R per physical block.

As one of ordinary skill in the art will appreciate, each row 120-0,120-1, . . . , 120-R can include, e.g., store, one or more physicalpages of data. A physical page refers to a unit of programming and/orsensing, e.g., a number of cells that are programmed and/or sensedtogether as a functional group of memory cells. In the embodiment shownin FIG. 1, each row 120-0, 120-1, . . . , 120-R stores one page of data.However, embodiments of the present disclosure are not so limited. Forinstance, in one or more embodiments of the present disclosure, each rowcan store multiple pages of data, with one or more even pages of dataassociated with even-numbered bit lines, and one or more odd pages ofdata associated with odd numbered bit lines. Additionally, forembodiments including multilevel cells, a physical page can be logicallydivided into an upper page and a lower page of data, with each cell in arow contributing one or more bits towards an upper page of data and oneor more bits towards a lower page of data. In one or more embodiments, amemory array can include multiple physical blocks of memory cells andeach physical block can be organized into multiple pages.

In one or more embodiments of the present disclosure, and as shown inFIG. 1, a page associated with a row can store data, e.g., after aprogramming operation, in accordance with a number of physical sectors122-0, 122-1, . . . , 122-S. Each physical sector 122-0, 122-1, . . . ,122-S can store data that corresponds to one or more logical sectors ofdata. For example, a particular physical sector, e.g., data stored inthe particular physical sector, can correspond to a particular logicalsector. Additionally, a portion of data stored in one or more physicalsectors can correspond to a particular logical sector. For example, afirst portion of data stored in a particular physical sector cancorrespond to a first logical sector, and a second portion of datastored in the particular physical sector can correspond to a secondlogical sector. Each physical sector 122-0, 122-1, . . . , 122-S, canalso store system and/or user data, and can include overheadinformation, such as error correction code (ECC) information and logicalblock address (LBA) information.

As one of ordinary skill in the art will appreciate, logical blockaddressing is a scheme that can be used by a host for identifying alogical sector of data. For example, each logical sector can correspondto a unique logical block address (LBA). Additionally, an LBA may alsocorrespond to a physical address. As an example, a logical sector ofdata can be a number of bytes of data, e.g., 256 bytes, 512 bytes, or1,024 bytes. However, embodiments are not limited to these examples.

In one or more embodiments of the present disclosure, a number of LBAscan correspond to a logical unit. That is, a logical unit can include anumber of LBAs, e.g., a number of logical sectors of data. Additionally,in one or more embodiments, a logical unit can be associated with one ormore logical partitions. For example, a particular logical unit cancorrespond to a particular logical partition. Additionally, a logicalunit can be a subdivision of a logical partition, e.g., a logicalpartition can include two or more logical units. Alternatively, alogical partition can be a subdivision of a logical unit, e.g., alogical unit can include two or more logical partitions.

It is noted that other configurations for the physical blocks 116-0,116-1, . . . , 116-B, rows 120-0, 120-1, . . . , 120-R, sectors 122-0,122-1, . . . , 122-S, and pages are possible. For example, rows 120-0,120-1, . . . , 120-R of physical blocks 116-0, 116-1, . . . , 116-B caneach store data corresponding to a single logical sector which caninclude, for example, more or less than 512 bytes of data.

FIG. 2 illustrates a block diagram of a memory device 232 in accordancewith one or more embodiments of the present disclosure. Memory device232 can be, for example, a flash memory device, such as a universalflash storage (UFS) device. However, embodiments of the presentdisclosure are not limited to a particular type of memory device.

As shown in FIG. 2, memory device 232 includes a memory array 200.Memory array 200 can be analogous to, for example, memory array 100previously described in connection with FIG. 1. Although one memoryarray is shown in FIG. 2, embodiments of the present disclosure are notso limited, e.g., memory device 232 can include more than one memoryarray.

As shown in FIG. 2, memory array 200 includes a boot partition 236 and anumber of additional partitions 238-0, 238-1, . . . , 238-P. The numberof additional partitions can be, for example, eight or sixteen. However,embodiments of the present disclosure are not limited to a particularnumber of additional partitions. Additionally, although memory array 200is shown in FIG. 2 as including one boot partition, embodiments of thepresent disclosure are not so limited, e.g., memory array 200 caninclude more than one boot partition.

Boot partition 236 and/or additional partitions 238-0, 238-1, . . .238-P can be physical partitions, e.g., one or more physical blocks,rows, pages, or sectors, as previously described herein. Boot partition236 and/or additional partitions 238-0, 238-1, . . . , 238-P can also belogical partitions. For example, boot partition 236 and/or additionalpartitions 238-0, 238-1, . . . , 238-P can each correspond to aparticular logical unit, boot partition 236 and/or additional partitions238-0, 238-1, . . . , 238-P can be subdivisions of logical units, and/orlogical units can be subdivisions of boot partition 236 and/oradditional partitions 238-0, 238-1, . . . , 238-P, as previouslydescribed herein.

A boot partition, as used herein, can be a physical or logical partitionin a memory array that includes boot code for a memory system that isexecutable by a host in the memory system. For example, boot partition236 can include boot code for a memory system, such as memory system 350described in connection with FIG. 3, that is executable by a host, suchas host 352 described in connection with FIG. 3, in the memory system.The boot code can be used, e.g., executed, by the host to boot thememory system during a booting operation, e.g., a booting operation ofthe memory system, as will be further described herein.

In embodiments in which memory array 200 includes more than one bootpartition, the boot partitions can include different boot code for thememory system. For example, a first partition can include a firstversion of boot code, a second partition can include a second version ofboot code that is different than the first version, a third partitioncan include a third version of boot code that is different than thefirst and second versions, etc. Additionally, the boot partitions caninclude identical boot code for the memory system. For example, one ofthe boot partitions can include particular boot code, and the other bootpartitions can include duplicate copies of the particular boot code,e.g., for redundancy.

Additional partitions 238-0, 238-1, . . . , 238-P can be non-bootpartitions, e.g., partitions that do not include boot code and/or arenot used during a booting operation. Rather, additional partitions238-0, 238-1, . . . , 238-P can be partitions that are used duringprogramming, sensing, and/or erase operations performed on memory device232. That is, additional partitions 238-0, 238-1, . . . 238-P can storedata associated with programming, sensing, and/or erase operationsperformed on memory device 232.

As shown in FIG. 2, memory device 232 also includes control circuitry234 coupled to memory array 200. Control circuitry 234 can be configuredto associate logical unit identifiers with boot partition 236 andadditional partitions 238-0, 238-1, . . . , 238-P. The logical unitidentifiers can be, for example, logical unit numbers (LUNs). However,embodiments of the present disclosure are not limited to a particulartype of logical unit identifier.

For example, control circuitry 234 can be configured to assign, in aconfiguration descriptor list, a unique logical unit identifier, e.g., aunique logical unit number (LUN), to boot partition 236 and a uniquelogical unit identifier, e.g., a unique LUN, to each additionalpartition 238-0, 238-1, . . . , 238-P. The LUNs can be associated with,e.g., assigned to, boot partition 236 and additional partitions 238-0,238-1, . . . , 238-P during manufacture and/or operation of memorydevice 232.

The LUN associated with boot partition 236 can be a default LUN that hasbeen pre-assigned to boot partition 236. That is, a particular LUN canbe pre-assigned as the default LUN to be associated with, e.g., assignedto, boot partition 236, and control circuitry 234 can be configured toassign the particular LUN to boot partition 236.

The LUNs associated with additional partitions 238-0, 238-1, . . . 238-Pcan be sequential LUNs and/or can be within a range of LUNs. The LUNassociated with boot partition 236 may not be in sequence with thesequential LUNs associated with additional partitions 238-0, 238-1, . .. , 238-P. Additionally, the LUN associated with boot partition 236 canbe outside the range of LUNs associated with additional partitions238-0, 238-1, . . . , 238-P. Further, the LUN associated with bootpartition 236 can be larger than each of the LUNs associated withadditional partitions 238-0, 238-1, . . . , 238-P. For example, thesequence and/or range of LUNs associated with additional partitions238-0, 238-1, . . . , 238-P can include all integers from 0 to N−1,inclusive, wherein N is equal to the number of additional partitions238-0, 238-1, . . . , 238-P, and the LUN associated with boot partition236 may be outside this sequence and/or range, e.g., the LUN associatedwith boot partition 236 can be larger than N. For instance, if thenumber of additional partitions is eight, the sequence and/or range ofLUNs associated with the additional partitions can be LUN [0], LUN [1],. . . , LUN [7], and the LUN associated with the boot partition can beLUN [X], wherein X is outside this sequence and/or range, e.g., LUN[99].

Associating a LUN with boot partition 236 that is not in sequence withand/or outside the range of the LUNs associated with additionalpartitions 238-0, 238-1, . . . , 238-P in accordance with one or moreembodiments of the present disclosure can prevent a user from viewing aboot partition 236, e.g., the boot code associated with boot partition236. For example, boot partition 236 may not be visible to a user of ahost, such as host 352 described in connection with FIG. 3, coupled tomemory device 232. That is, boot partition 236 may be hidden from theuser.

The embodiment illustrated in FIG. 2 can include additional circuitrythat is not illustrated so as not to obscure embodiments of the presentdisclosure. For example, memory device 232 can include address circuitryto latch address signals provided over I/O connectors through I/Ocircuitry. Address signals can be received and decoded by a row decoderand a column decoder, to access memory array 200. It will be appreciatedby those skilled in the art that the number of address input connectorscan depend on the density and architecture of memory device 232 and/ormemory array 200.

FIG. 3 illustrates a block diagram of a memory system 350 in accordancewith one or more embodiments of the present disclosure. As shown in FIG.3, memory system 350 includes a host 352 and a memory device 332 coupledto host 352. Memory device 332 can be analogous to, for example, memorydevice 232 previously described in connection with FIG. 2. Although onememory device is shown coupled to host 352 in FIG. 3, embodiments of thepresent disclosure are not so limited, e.g., memory system 350 caninclude more than one memory device coupled to host 352 in, for example,a hub-and-spoke or chained configuration.

As shown in FIG. 3, host 352 includes a port 354, a host controller 356,a host processor 358, a host memory 360, a host memory controller 362,and a direct memory access (DMA) engine 364. One of skill in the artwill appreciate that host processor 358 can include a number ofprocessors, such as a parallel processing system, a number ofcoprocessors, etc. Host 352 can also include additional elements, e.g.,additional computing device elements, not shown in FIG. 3, as will beunderstood by one of skill in the art.

Host 352 can be a computing device, such as a personal computer, amongother computing device types. Examples of host 352 include laptopcomputers, personal computers, mobile phones, digital cameras, digitalrecording and play back devices, PDA's, memory card readers, andinterface hubs, among other examples. Host 352 can include a singlemonolithic chip, multiple chips in a single package and/or module,and/or a combination of packages and/or modules on a printed circuitboard.

As shown in FIG. 3, host controller 356 is coupled to port 354 and hostprocessor 358. Host controller 356 is also coupled to host memory 360via DMA engine 364 and host memory controller 362. Although host memory360 is shown as being located within host 352, embodiments of thepresent disclosure are not so limited. For example, host memory 360 canbe separate from, e.g., located outside of, host 352, and/or can belocated within memory device 332. In both of the examples above, hostmemory 360 can be considered “associated with” host 352.

Port 354 can be a hardware port. A hardware port can be used to couple ahardware device to host 352. For example, a hardware port can be used tocouple a peripheral device, such as a digital camera, an MP3 player, anetwork device, and/or USB device, among other devices, to host 352. Ahardware port can also be used to couple a media codec to host 352 forplay-back of audio and/or video. The coupling of a hardware device tohost 352 via port 354 can allow the hardware device to communicate withmemory device 332, host memory 360, and/or other memory in host 352.Communication can include, for example, reading, writing, and/or erasingdata to and/or from the hardware devices, memory device 332, and/or thememory on or coupled to host 352.

Host controller 356 can be used to communicate information between host352 and memory device 332, e.g., to communicate information from host352 to memory device 332 and to communicate information from memorydevice 332 to host 352. For example, host controller 356 can be coupledto implement a standardized interface (not shown) for passing control,address, data, instructions, commands, and other signals between host352, e.g., host processor 358, and memory device 332. Additionally, whenmemory device 332 is used for data storage for memory system 350, hostcontroller 356 can implement a serial advanced technology attachment(SATA), a peripheral component interconnect express (PCIe), a universalserial bus (USB), a small computer system interface (SCSI), and/or auniversal flash storage (UFS), among other interfaces.

Memory device 332 can include a boot partition that includes boot codefor memory system 350, and a number of additional, e.g., non-boot,partitions, as previously described herein. The additional partitionscan have sequential and/or a range of logical unit identifiers, e.g.,logical unit numbers (LUNs), associated therewith, and the bootpartition can have a logical unit identifier, e.g., a logical unitnumber (LUN), associated therewith that is not in sequence with and/oris outside the range of the logical unit identifiers, e.g., LUNs,associated with the additional partitions, as previously describedherein.

Host 352 can be configured to select the boot partition that includesboot code for memory system 350. Memory device 332, e.g., controlcircuitry in memory device 332, can be configured to associate the LUNwith, e.g., assign the LUN to, the boot partition responsive to theselection of the boot partition by host 352.

Host 352 can be aware of the LUN associated with the boot partition. Forexample, the LUN associated with the boot partition can be stored inhost memory 360, and/or the LUN associated with the boot partition canbe known to host processor 358. Additionally, the LUN associated withthe boot partition can be a default LUN that has been pre-assigned tothe boot partition, as previously described herein. However, the bootpartition, e.g., the boot code associated with the boot partition, maynot be visible to a user of host 352, as previously described herein.

Host 352 can use the boot code to boot memory system 350, e.g., host 352and/or memory device 332, responsive to an event of memory system 350.For example, responsive to an event of memory system 350, host processor358 can use the LUN associated with the boot partition to access, e.g.,load, the boot code, e.g., data representing the boot code, from memorydevice 332 through host controller 356. As used herein, “an event” of amemory system can include a booting event of the memory system, such asa power-on and/or a reset of the memory system, among other examples.

For example, responsive to an event of memory system 350, host processor358 can execute an instruction, e.g., a specific data sequence and/orreference clock, to send a boot command, e.g., a boot code read command,to memory device 332 through host controller 356. The boot command canbe addressed to the LUN associated with the boot partition, e.g., theboot command can include the LUN associated with the boot partition. Theboot command can also include a header that identifies the command as aboot command. Responsive to receiving the boot command, memory device332 can send the boot code, e.g., data representing the boot code, tohost 352. The data can include a header that identifies the data as bootcode data. Responsive to receiving the boot code, host processor 358 canexecute the boot code to boot memory system 350.

CONCLUSION

The present disclosure includes boot partitions in memory devices andsystems, and methods associated therewith. One or more embodimentsinclude an array of memory cells, wherein the array includes a bootpartition and a number of additional partitions. Sequential logical unitidentifiers are associated with the additional partitions, and a logicalunit identifier that is not in sequence with the sequential logical unitidentifiers is associated with the boot partition.

Although specific embodiments have been illustrated and describedherein, those of ordinary skill in the art will appreciate that anarrangement calculated to achieve the same results can be substitutedfor the specific embodiments shown. This disclosure is intended to coveradaptations or variations of a number of embodiments of the presentdisclosure. It is to be understood that the above description has beenmade in an illustrative fashion, and not a restrictive one. Combinationof the above embodiments, and other embodiments not specificallydescribed herein will be apparent to those of skill in the art uponreviewing the above description. The scope of a number of embodiments ofthe present disclosure includes other applications in which the abovestructures and methods are used. Therefore, the scope of a number ofembodiments of the present disclosure should be determined withreference to the appended claims, along with the full range ofequivalents to which such claims are entitled.

In the foregoing Detailed Description, some features are groupedtogether in a single embodiment for the purpose of streamlining thedisclosure. This method of disclosure is not to be interpreted asreflecting an intention that the disclosed embodiments of the presentdisclosure have to use more features than are expressly recited in eachclaim. Rather, as the following claims reflect, inventive subject matterlies in less than all features of a single disclosed embodiment. Thus,the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment.

1. A memory device, comprising: an array of memory cells, wherein: thearray includes a boot partition and a number of additional partitions;sequential logical unit identifiers are associated with the additionalpartitions; and a logical unit identifier that is not in sequence withthe sequential logical unit identifiers is associated with the bootpartition.
 2. The memory device of claim 1, wherein the boot partitionincludes boot code executable by a host.
 3. The memory device of claim2, wherein the memory device is configured to send the boot code to thehost responsive to receiving a command from the host addressed to thelogical unit identifier associated with the boot partition.
 4. Thememory device of claim 1, wherein the boot partition is a logical unit.5. The memory device of claim 1, wherein the boot partition is asubdivision of a logical unit.
 6. The memory device of claim 1, whereinthe boot partition includes a number of logical units.
 7. The memorydevice of claim 1, wherein: sequential logical unit numbers areassociated with the additional partitions; and a logical unit numberthat is not in sequence with the sequential logical unit numbers isassociated with the boot partition.
 8. A memory device, comprising: anarray of memory cells, wherein the array includes a number of bootpartitions and a number of additional partitions; and control circuitrycoupled to the array, wherein the control circuitry is configured to:associate logical unit identifiers with the additional partitions,wherein the logical unit identifiers are within a range of logical unitidentifiers; and associate a logical unit identifier with one of theboot partitions, wherein the logical unit identifier is outside therange of logical unit identifiers associated with the additionalpartitions.
 9. The memory device of claim 8, wherein the controlcircuitry is configured to: assign a unique logical unit identifier toeach of the additional partitions, wherein the assigned logical unitidentifiers are within the range of logical unit identifiers; and assignthe logical unit identifier to one of the boot partitions, wherein theassigned logical unit identifier is outside the range of logical unitidentifiers assigned to the additional partitions.
 10. The memory deviceof claim 8, wherein the range of logical unit identifiers includes allintegers from 0 to N−1, inclusive, wherein. N is equal to the number ofadditional partitions.
 11. The memory device of claim 8, wherein thememory device is a flash memory device.
 12. The memory device of claim8, wherein the number of boot partitions are physical partitions. 13.The memory device of claim 8, wherein the control circuitry isconfigured to: associate logical unit numbers with the additionalpartitions, wherein the logical unit numbers are within a range oflogical unit numbers; and associate a logical unit number with one ofthe boot partitions, wherein the logical unit number is outside therange of logical unit numbers associated with the additional partitions.14. The memory device of claim 8, wherein: the array includes more thanone boot partition; and the boot partitions include different boot codeexecutable by a host.
 15. The memory device of claim 8, wherein: thearray includes more than one boot partition; and the boot partitionsinclude identical boot code executable by a host.
 16. A method foroperating a memory device, comprising: associating sequential logicalunit identifiers with a number of partitions in the memory device; andassociating a logical unit identifier with a boot partition in thememory device, wherein the logical unit identifier associated with theboot partition is not in sequence with the sequential logical unitidentifiers associated with the number of partitions.
 17. The method ofclaim 16, wherein: associating sequential logical unit identifiers withthe number of partitions includes assigning, in a configurationdescriptor list associated with the memory device, the sequentiallogical unit identifiers to the number of partitions; and associatingthe logical unit identifier with the boot partition includes assigning,in the configuration descriptor list, the logical unit identifier to theboot partition.
 18. The method of claim 16, wherein the method includesbooting a host device using the boot partition and the logical unitidentifier associated with the boot partition.
 19. The method of claim16, wherein the method includes performing programming, sensing, anderase operations on the memory device using the number of partitions andthe sequential logical unit identifiers associated with the number ofpartitions.
 20. A method for operating a memory device, comprising:associating logical unit identifiers with a number of partitions in thememory device, wherein the logical unit identifiers are within a rangeof logical unit identifiers; and associating a unique logical unitidentifier with a boot partition in the memory device, wherein theunique logical unit identifier associated with the boot partition isoutside the range of logical unit identifiers associated with the numberof partitions.
 21. The method of claim 20, wherein the method includesreceiving a command addressed to the unique logical unit identifierassociated with the boot partition.
 22. The method of claim 20, whereinthe method includes sending boot code to a host responsive to receivingthe command.
 23. The method of claim 20, wherein the unique logical unitidentifier associated with the boot partition is larger than each of thelogical unit identifiers associated with the number of partitions. 24.The method of claim 20, wherein the method includes pre-assigning theunique logical unit identifier as a default logical unit identifier tobe associated with the boot partition.
 25. A system, comprising: amemory device having an array of memory cells, wherein: the arrayincludes a number of boot partitions and a number of additionalpartitions; sequential logical unit identifiers are associated with theadditional partitions; and a logical unit identifier that is not insequence with the sequential logical unit identifiers is associated withone of the boot partitions; and a host coupled to the memory device,wherein the host is aware of the logical unit identifier associated withthe one of the boot partitions.
 26. The system of claim 25, wherein: thehost includes a memory; and the memory includes the logical unitidentifier associated with the one of the boot partitions.
 27. Thesystem of claim 25, wherein the host is configured to use the logicalunit identifier associated with the one of the boot partitions to accessthe one of the boot partitions during a booting operation.
 28. Thesystem of claim 25, wherein the logical unit identifier associated withthe one of the boot partitions is a unique logical unit identifier. 29.The system of claim 25, wherein the one of the boot partitions is notvisible to a user of the host.
 30. The system of claim 25, wherein thelogical unit identifier associated with the one of the boot partitionsis a default logical unit identifier pre-assigned to the one of the bootpartitions.
 31. The system of claim 25, wherein the one of the bootpartitions includes boot code for the system.
 32. The system of claim31, wherein: the host is configured to select the one of the bootpartitions; and the memory device is configured to associate the logicalunit identifier that is not in sequence with the sequential logical unitidentifiers with the one of the boot partitions responsive to theselection of the one of the boot partitions.
 33. A system, comprising: amemory device having an array of memory cells, wherein: the arrayincludes a boot partition and a number of additional partitions; logicalunit identifiers are associated with the additional partitions, whereinthe logical unit identifiers are within a range of logical unitidentifiers; and a logical unit identifier is associated with the bootpartition, wherein the logical unit identifier is outside the range oflogical unit identifiers associated with the additional partitions; anda host coupled to the memory device, wherein the host is aware of thelogical unit identifier associated with the boot partition.
 34. Thesystem of claim 33, wherein: the host is configured to send a command tothe memory device addressed to the logical unit identifier associatedwith the boot partition responsive to an event of the system; and thememory device is configured to send the boot code to the host responsiveto receiving the command.
 35. The system of claim 34, wherein the eventis a power-on of the system.
 36. The system of claim 34, wherein theevent is a reset of the system.
 37. The system of claim 34, wherein thecommand is a boot command.